LED隐切设备

两束/道激光加工，配有光束间隙自动调节功能，可最大程度提高WPH

破碎晶圆可全自动加工，包括边缘检测/视觉定位/自动隐切

配有高度传感器，测量/补偿晶圆片平整度，达到3um精度

在单个料盒设置不同的配方

在CH1/CH2 可设置不同的切割参数

Two beams/pass  processing equipped with beam gap auto adjustment to maximize WPH

Fully automatic broken wafer processing include edge detection / vision align / auto dicing. 

Equipped with height sensor to measure/compensate wafer flatness to achieve 3um accuracy. 

Different recipe setting in single cassettes

Different dicing parameter for CH1/CH2

参数配置

功能描述

主要功能：通过在蓝宝石晶圆片内部聚集激光来实现对晶圆层的加工,不会对晶圆的表面产生任何影响

进出料方式：Ring Frame

设备尺寸：L1560 * W1600 * H1800mm

Applicable products: 4-inch, 6-inch, LED sapphire wafer / SiC wafer

Main function: to achieve modified layer in the sapphire wafer by focusing a laser inside the wafer，not affect the surface of the wafer

Import and export method: Ring Frame

Size: L1560 * W1600 * H1800mm